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FOR SALE TOOLS --- Semiconductor Assembly
  • Grinding
  • Die/Wire Bonding
  • Molding/Packaging
  • SMT Related, etc...
ASSY: B/G, Dicing
TTC ID MAKER MODEL DESCRIPTION VIN. QTY INQ.
20081219g2I005DiscoDFG840(8")Back Side Grinder新着中古装置情報_New_Release_201219961TTC半導体中古装置_2008
20081209g1N001DiscoDFG840(8")Back Side Grinder新着中古装置情報_New_Release_20081994
1995
1996
1997
4TTC半導体中古装置_2008
20081002a2A006KAIJO1200-28FDicing Frame Clean19991TTC半導体中古装置_2008
20081002a2A005Nomura MicroNB-IIICO2 Bubbler19961TTC半導体中古装置_2008
20081002a2A004Nomura MicroNB-IICO2 Bubbler19961TTC半導体中古装置_2008
20081002a2A003EyegraphicsECS-301(5")UV Cure19921TTC半導体中古装置_2008
20081002a2A002TakatoriATM-8100(5")Wafer Mounter19961TTC半導体中古装置_2008
20080904a1L003DiscoDFD6361Dicing Saw,Fully AutomaticInq.1
20080904a1L002DiscoDFD6361Dicing Saw,Fully Automatic20061
20080904a1L001DiscoDFD6361Dicing Saw,Fully Automatic20061
20080825f1O001EMTECCVP-220(8")W/F Beveling20051
20080801a6L01SHINKAWASBB-310Bump bonder20011
20080616f2B19OkamotoVG201Automatic Grinding Tool (WF=150mm)20021
20080602a2B02OPTO Sys.OSH-80TPSCRIBER20011
20080602a2B01OPTO Sys.OSH-90TPBREAKER20011


ASSY: (Die/Wire)Bonder
TTC ID MAKER MODEL DESCRIPTION VIN. QTY INQ.
20081215b1T040DAGE?4000Multi-purpose Bondtester新着中古装置情報_New_Release_200820061TTC半導体中古装置_2008
20081215b1T023ShibauraInq.LCD Bonding 新着中古装置情報_New_Release_200820061TTC半導体中古装置_2008
20081215b1T010TakatoriInq.Chip Bonder新着中古装置情報_New_Release_200820021TTC半導体中古装置_2008
20081215b1T009TakatoriSOB-2TCP Bonder新着中古装置情報_New_Release_200820042TTC半導体中古装置_2008
20081215b1T007PanasonicInq.COG Bonder新着中古装置情報_New_Release_200820041TTC半導体中古装置_2008
20081215b1T006PanasonicFPD-MCOG Bonder新着中古装置情報_New_Release_200820041TTC半導体中古装置_2008
20081106a3E045ASMAD809Die Bonder19781TTC半導体中古装置_2008
20081106a3E044ASMAD809Die Bonder19883TTC半導体中古装置_2008
20081106a3E043ASMAD809Die Bonder19863TTC半導体中古装置_2008
20081106a3E042ASMAD809Die Bonder19841TTC半導体中古装置_2008
20081106a3E041ASMAD809Die Bonder19821TTC半導体中古装置_2008
20081106a3E040DiscoDSM060Wafer Mount19841TTC半導体中古装置_2008
20081106a3E039Lonh HillLH-830Wafer Mount19881TTC半導体中古装置_2008
20081104a1A012PanasonicDM-60M-HDie Bonder19981TTC半導体中古装置_2008
20081104a1A011PanasonicDM-60M-HDie Bonder19991TTC半導体中古装置_2008
20081104a1A010PanasonicDM-60MDie Bonder20001TTC半導体中古装置_2008
20081104a1A009PanasonicDM-60MDie Bonder20001TTC半導体中古装置_2008
20081030a3E015K&S1488 TurboWire Bonder新着中古装置情報_New_Release_2008Inq.10TTC半導体中古装置_2008
20081021a2D002ShinkawaUTC-400BIWire Bonder, Gold新着中古装置情報_New_Release_200820042TTC半導体中古装置_2008
20081021a1D001ShinkawaUTC-400BIWire Bonder, Gold20034TTC半導体中古装置_2008
20081006a1E001K&S8060Wire BonderInq.1TTC半導体中古装置_2008
20081004a1T001K&S8060Wire Bonder (Automatic Wedge Bonder)19982TTC半導体中古装置_2008
20081002a2A012ShinkawaUTC-380BIWire Bonder20003TTC半導体中古装置_2008
20081002a2A011ShinkawaUTC-380BIWire Bonder20012TTC半導体中古装置_2008
20081002a2A007Canon MachineryInq.(5")Die Bonder20001TTC半導体中古装置_2008
20080926a3I003KAIJOFB-131Wire Bonder 19981TTC中古装置_20080916f1A002
20080922a3L030SHINKAWASBB-410STUD BUMP BONDER20031TTC中古装置_20080916f1A002
20080922a3L030SHINKAWASBB-410STUD BUMP BONDER20031中古半導体装置 20080922a3L030
20080910a2E007ASM PacificAD819-12Die Bonder20021
20080905a1E008K&S 1488 TourboWire bonderInq.1
20080905a1E007K&S 1488 Tubo-LWire bonderInq.2
20080905a1E006ESEC 3006 F/XXWire bonderInq.1
20080905a1E005Panasonic HW26U-B Wire bonderInq.1
20080822a5O023Westbond7327ADie Bonder19991
20080822a5O022Westbond7327C-79Die Bonder20011
20080822a5O021Westbond7327C-79Die Bonder20011
20080710a2W02K&S1488 TurboWire BonderInq.1
20080710a2W01K&S1488 TurboWire BonderInq.1
20080613a2Y10 Panasonic DM-60M-H Die Bonder 1998 1
20080613a2Y09 Panasonic DM-60M-H Die Bonder 1999 1
20080613a2Y08 Panasonic DM-60M Die Bonder 2000 1
20080613a2Y07 Panasonic DM-60M Die Bonder 2000 1
20080603a1N01HITACHIWB-500AWire Bonder 19989
20080603a1N02KAIJOFB-128Wire Bonder 199716
20080603a1N03KAIJOFB-131Wire Bonder 199769
20080602a1B60ShinkawaUTC-50Wire Bonder19881
20080602a1B59ShinkawaUTC-50Wire Bonder19881
20080602a1B58ShinkawaUTC-50Wire Bonder19881
20080602a1B57ShinkawaUTC-50Wire Bonder19881
20080602a1B56ShinkawaUTC-50Wire Bonder19881
20080602a1B55ShinkawaUTC-50Wire Bonder19881
20080602a1B54ShinkawaUTC-50Wire Bonder19881
20080602a1B53ShinkawaUTC-50Wire Bonder19881
20080602a1B52ShinkawaUTC-50Wire Bonder19881
20080602a1B51ShinkawaUTC-50Wire Bonder19881
20080602a1B50ShinkawaUTC-50Wire Bonder19881
20080602a1B49ShinkawaUTC-50Wire Bonder19881
20080602a1B48ShinkawaUTC-50Wire Bonder19881
20080602a1B47ShinkawaUTC-50Wire Bonder19881
20080602a1B46ShinkawaUTC-50Wire Bonder19881
20080602a1B45ShinkawaUTC-50Wire Bonder19881
20080602a1B44ShinkawaUTC-50Wire Bonder19881
20080602a1B43ShinkawaUTC-50Wire Bonder19881
20080602a1B42ShinkawaUTC-200Wire Bonder19951
20080602a1B41ShinkawaUTC-200Wire Bonder19951
20080602a1B40ShinkawaUTC-200Wire Bonder19951
20080602a1B39ShinkawaUTC-200Wire Bonder19951
20080602a1B38ShinkawaUTC-200Wire Bonder19951
20080602a1B37ShinkawaUTC-200Wire Bonder19951
20080602a1B36ShinkawaUTC-200Wire Bonder19951
20080602a1B35ShinkawaUTC-200Wire Bonder19951
20080602a1B34ShinkawaUTC-200Wire Bonder19951
20080602a1B33ShinkawaUTC-200Wire Bonder19951
20080602a1B32ShinkawaUTC-100Wire Bonder19931
20080602a1B31ShinkawaUTC-100Wire Bonder19931
20080602a1B30ShinkawaUTC-100Wire Bonder19931
20080602a1B29ShinkawaUTC-100Wire Bonder19931
20080602a1B28ShinkawaUTC-100Wire Bonder19931
20080602a1B27ShinkawaUTC-100Wire Bonder19931
20080602a1B26ShinkawaUTC-100Wire Bonder19931
20080602a1B25ShinkawaUTC-100Wire Bonder19931
20080602a1B24ShinkawaUTC-100Wire Bonder19931
20080602a1B23ShinkawaUTC-100Wire Bonder19931
20080602a1B22ShinkawaUTC-100Wire Bonder19931
20080602a1B21SONICSURB-412Wire Bonder19961
20080602a1B20SONICSURB-412Wire Bonder19961
20080602a1B19SONICSURB-412Wire Bonder19961
20080602a1B18SONICSURB-412Wire Bonder19961
20080602a1B17SONICSURB-412Wire Bonder19961
20080602a1B16SONICSURB-412Wire Bonder19961
20080602a1B15KAIJOFB118AWire Bonder19931
20080602a1B14KAIJOFB118AWire Bonder19931
20080602a1B13KAIJOFB118AWire Bonder19931
20080602a1B12KAIJOFB118AWire Bonder19931
20080602a1B11KAIJOFB118AWire Bonder19931
20080602a1B10KAIJOFB118AWire Bonder19931
20080602a1B09KAIJOFB118AWire Bonder19931
20080602a1B08KAIJOFB118AWire Bonder19931
20080602a1B07KAIJOFB118AWire Bonder19931
20080602a1B06KAIJOFB118AWire Bonder19931
20080602a1B05KAIJOFB118AWire Bonder19931
20080602a1B04KAIJOFB118AWire Bonder19931
20080602a1B03KAIJOFB118AWire Bonder19931
20080602a1B02KAIJOFB118AWire Bonder19931
20080602a1B01KAIJOFB118AWire Bonder19931
20080528a1W01ShinkawaILT-110Inner Lead BonderInq.1
20080317a1W01PanasonicDM60HDie Bonder19981


ASSY: Other
TTC ID MAKER MODEL DESCRIPTION VIN. QTY INQ.
20081106a4E051Branson5510Ultrosonic cleanerInq.1TTC半導体中古装置_2008
20081106a4E050YamatoDKN400Concevtion ovenInq.6TTC半導体中古装置_2008
20081106a4E049VWR Scientific Inc.VWR1410Vacuum ovenInq.1TTC半導体中古装置_2008
20081106a4E048Lindberg/Blue MGO1310AConvection OvenInq.1TTC半導体中古装置_2008
20081106a4E047ENRPR-602WPad Printer19891TTC半導体中古装置_2008
20081106a4E046ENRPR-602WPad Printer19883TTC半導体中古装置_2008
20081106a3E036GplineGUC-184MUV Dryer20032TTC半導体中古装置_2008
20081106a3E035MBKTR-1500SXWafer Sorter20011TTC半導体中古装置_2008
20081106a3E034MITTTR80Tape & ReelInq.1TTC半導体中古装置_2008
20081106a3E033STILM-6023Laser MarkerInq.1TTC半導体中古装置_2008
20081106a3E032GSView880-200Scannning Tool19983TTC半導体中古装置_2008
20081104a1A008SUNXLP-F10FIBER LASER MARKER20041TTC半導体中古装置_2008
20081104a1A007Inq.NR030-2945Peeling Tool20041TTC半導体中古装置_2008
20081104a1A006DAGEMODEL 4000Wire bond pull tester20001TTC半導体中古装置_2008
20081002a2A019MATSUOInq.Laser Marker20001TTC半導体中古装置_2008
20081002a2A018MATSUOInq.Laser Marker19951TTC半導体中古装置_2008
20081002a2A017NECInq.L/Mark Handler20012TTC半導体中古装置_2008
20081002a2A016MIYACHIML-2050ALaser Spot Welder20022TTC半導体中古装置_2008
20081002a2A015NEC?CAMS-1Mold Press20011TTC半導体中古装置_2008
20081002a2A014Apic YamadaMS-7050FMold Press19971TTC半導体中古装置_2008
20081002a2A013NECSL-432G2Laser Trimer19971TTC半導体中古装置_2008
20081001a2C031ICOSCI-9250Macro Inspection20041TTC中古装置情報問合せ
20080926a1L001ICOSCI-9250COMPONENT INSPECTION ToolInq.1TTC中古装置_20080916f1A002
20080916f1A003Yamato ScientificDT62OvenInq.1TTC中古装置_20080916f1A003
20080827c1L003FUJIIMPULSEFV-600-NG-10WVacuum and gas flush sealer20001
20080714a2W14SHINKAWASPA-210DIE ATTACHER20001
20080714a2W13SHINKAWASPA-200DIE ATTACHER20001
20080714a2W12SHINKAWASPA-210DIE ATTACHER20011
20080714a2W11SHINKAWASPA-210DIE ATTACHER20011
20080714a2W10SHINKAWASPA-210DIE ATTACHER20011
20080714a2W09OSUNG LST01021142110-1VACUUM CHAME20011
20080714a2W08OSUNG LSTOS4-120AVCCURE OVEN19991
20080714a2W07June TechJTS2000WMBT SORTER19981
20080714a2W06June TechJTS2000WMBT SORTER19971
20080714a2W05June TechJTS2000WMBT SORTER19981
20080714a2W04June TechJTS2000WMBT SORTER19971
20080714a2W03SECRONUTS-2001STACK-TACK20011
20080714a2W02GENERAL
SCANNING
LM6000MARKER19971
20080714a2W01GENERAL
SCANNING
LM6000MARKER19961
20080708a1E02A.E AdvancedMWM-850Wafer mountingInq.1
20080708a1E01KEYENCEML-9100Laser markInq.2
20080616a2B02DYNATEXGST-150Scribeer Breaker20021
20080613a2Y06 DAGE MODEL 14000 BUMP Share Tester 2000 1
20080603a1N05KIGIANT200 tonsMold Press199711
20080603a1N06GPDBGAmolding machine19981
20080603a1N07INQUPH 22000Wafer molding machine19981
20080603a1N08ASMInq.BGA margin cutter19981
20080603a1N09YF-02BGABGA washer19981
20080603a1N10KINEGYAFL-CH2-04SINQ199715
20080603a1N12DEMINSIZE 40-58mmpreheater19982
20080603a1N13DEMINSSOP48Lpreheater19981
20080603a1N14GTAZX-CO-106laser printer CO219981
20080603a1N16GPMSOJ42 SSOP48shaper19982
20080603a1N17YAMADASOJ 24/26auto shaper19971
20080603a1N18ASMSOJ 24/26shaper-219971
20080603a1N19EVER TECHFOR TRAY QFP
TSOP FP-550
lead scan19981
20080603a1N20EVER TECHSSOP-48/56Lsemi-auto lead scan19982
20080603a1N21EVER TECHSPJ 300/400MIL
SSR-300A
lead scan19981
20080603a1N22MotecBIBU100unloader19971
20080603a1N23MotecBIBL100loader19971
20080603a1N24MotecBIBL100unloader/loader19981
20080603a1N25MotecPPLU 100unloader/loader19981
20080603a1N26GTA
electronic
ZX-LU-101laser marker19971
20080603a1N27YAGInqlaser marker19971
20080603a1N28E&R
engineering
PR2000ink marker20001
20080603a1N29MISUZUBA-1100INQ19981
20080602a2B07OPTO Sys.LPAM7000V16-TChip Sorter20011
20080602a2B06ASMMS896Chip Sorter20011
20080602a2B05OPTO Sys.WPOH-105AS-TCHIP TEST20011
20080602a2B04JTJCS-6300Chip Sorter20011
20080602a2B03JTJCP-1000CHIP TEST20011
20080418a1P26MATSUOInq.Laser Marker20001
20080418a1P25MATSUOInq.Laser Marker19951
20080418a1P24NECInq.L/Mark Handler20012
20080418a1P23SUNXLP-F10Laser Marker20001
20080418a1P22MIYACHIML-2050ALaser Spot Welder20022
20080418a1P21MIYACHIML-2050ALaser Spot Welder20011
20080418a1P20NEC?CAMS-1Mold Press20011
20080418a1P19Apic YamadaMS-7050FMold Press19971
20080418a1P18NECSL-432G2Laser Trimer20002
20080418a1P17NECSL-432G2Laser Trimer19981
20080418a1P16NECSL-432G2Laser Trimer19973