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FOR SALE TOOLS --- Semiconductor Assembly
  • Grinding
  • Die/Wire Bonding
  • Molding/Packaging
(Back) Grind
TTC ID Manufacturer Model Description Vintage QTY Product
Dicing (Scribe)
TTC ID Manufacturer Model Description Vintage QTY Product
A171017d1556 ml TECDIA TEC-3005KD Breaker 2005 1
A171017d1557 ml TECDIA TEC-3005KD Breaker 2005 1
A171017d1589 ml TECDIA TEC-3005KD Breaker 2005 1
A171017d1G114 ml HONJIG HJ-W002A Die Matrix Expander 2008 1
A171017d1734 ml HONJIG HJ-W900G DIE FLIPPER 2015 1
A171017d2347 ml HONJIG HJ-W001F DIE FLIPPER 2015 1
A171017d1617 ml HONJIG HJ-W001 DIE FLIPPER 2007 1
A170927d1S145 ml Nichiden CF-159-000 Die Matrix Expander 1986 1
(Die/Wire) Bonding
TTC ID Manufacturer Model Description Vintage QTY Product
A170822b2S101 ml Panasonic FB30T-M Flip Chip Bonder Inq. 1
Packaging (Mold/Singulation, Trim/Form etc.)
TTC ID Manufacturer Model Description Vintage QTY Product
A170905p1W143 ml ATSUGI AP-2-M Press 1980 1
A170905p1W145 ml ATSUGI(HITACHI) AP-3 Press 2005 1
A170905p1W144 ml ATSUGI(HITACHI) AP-3-M Press 2004 1
A170905p1W146 ml ATSUGI(HITACHI) AP-3-M Press 2005 1